一、综合词汇

1、印制电路：printed circuit

2、印制线路：printed wiring

3、印制板：printed board

4、印制板电路：printed circuit board(PCB)

5、印制线路板：printed wiring board(PWB)

6、印制组件：printed component

7、印制接点：printed contact

8、印制板装配：printed board assembly

9、板：board

10、单面印制板：single-sided printed board(SSB)

11、双面印制板：double-sided printed board(DSB)

12、多层印制板：mulitlayer printed board(MLB)

13、多层印制电路板：mulitlayer printed circuit board

14、多层印制线路板：mulitlayer prited wiring board

15、刚性印制板：rigid printed board

16、刚性单面印制板：rigid single-sided printed borad

17、刚性双面印制板：rigid double-sided printed borad

18、刚性多层印制板：rigid multilayer printed board

19、挠性多层印制板：flexible multilayer printed board

20、挠性印制板：flexible printed board

21、挠性单面印制板：flexible single-sided printed board

22、挠性双面印制板：flexible double-sided printed board

23、挠性印制电路：flexible printed circuit(FPC)

24、挠性印制线路：flexible printed wiring

25、刚性印制板：flex-rigid printed board,rigid-flex printed board

26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed

27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board

28、齐平印制板：flush printed board

29、金属芯印制板：metal core printed board

30、金属基印制板：metal base printed board

31、多重布线印制板：mulit-wiring printed board

32、陶瓷印制板：ceramic substrate printed board

33、导电胶印制板：electroconductive paste printed board

34、模塑电路板：molded circuit board

35、模压印制板：stamped printed wiring board

36、顺序层压多层印制板：sequentially-laminated mulitlayer

37、散线印制板：discrete wiring board

38、微线印制板：micro wire board

39、积层印制板：buile-up printed board

40、积层多层印制板：build-up mulitlayer printed board(BUM)

41、积层挠印制板：build-up flexible printed board

42、表面层合电路板：surface laminar circuit(SLC)

43、埋入凸块连印制板：B2it printed board

44、多层膜基板：multi-layered film substrate(MFS)

45、层间全内导通多层印制板：ALIVH multilayer printed board

46、载芯片板：chip on board(COB)

47、埋电阻板：buried resistance board

48、母板：mother board

49、子板：daughter board

50、背板：backplane

51、裸板：bare board

52、键盘板夹心板：copper-invar-copper board

53、动态挠性板：dynamic flex board

54、静态挠性板：static flex board

55、可断拼板：break-away planel

56、电缆：cable

57、挠性扁平电缆：flexible flat cable(FFC)

58、薄膜开关：membrane switch

59、混合电路：hybrid circuit

60、厚膜：thick film

61、厚膜电路：thick film circuit

62、薄膜：thin film

63、薄膜混合电路：thin film hybrid circuit

64、互连：interconnection

65、导线：conductor trace line

66、齐平导线：flush conductor

67、传输线：transmission line

68、跨交：crossover

69、板边插头：edge-board contact

70、增强板：stiffener

71、基底：substrate

72、基板面：real estate

73、导线面：conductor side

74、组件面：component side

75、焊接面：solder side

76、印制：printing

77、网格：grid

78、图形：pattern

79、导电图形：conductive pattern

80、非导电图形：non-conductive pattern

81、字符：legend

82、标志：mark

二、基材：

1、基材：base material

2、层压板：laminate

3、覆金属箔基材：metal-clad bade material

4、覆铜箔层压板：copper-clad laminate(CCL)

5、单面覆铜箔层压板：single-sided copper-clad laminate

6、双面覆铜箔层压板：double-sided copper-clad laminate

7、复合层压板：composite laminate

8、薄层压板：thin laminate

9、金属芯覆铜箔层压板：metal core copper-clad laminate

10、金属基覆铜层压板：metal base copper-clad laminate

11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film

12、基体材料：basis material

13、预浸材料：prepreg

14、粘结片：bonding sheet

15、预浸粘结片：preimpregnated bonding sheer

16、环氧玻璃基板：epoxy glass substrate

17、加成法用层压板：laminate for additive process

18、预制内层覆箔板：mass lamination panel

19、内层芯板：core material

20、催化板材：catalyzed board,coated catalyzed laminate

21、涂胶催化层压板：adhesive-coated catalyzed laminate

22、涂胶无催层压板：adhesive-coated uncatalyzed laminate

23、粘结层：bonding layer

24、粘结膜：film adhesive

25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film

26、无支撑胶粘剂膜：unsupported adhesive film

27、覆盖层：cover layer(cover lay)

28、增强板材：stiffener material

29、铜箔面：copper-clad surface

30、去铜箔面：foil removal surface

31、层压板面：unclad laminate surface

32、基膜面：base film surface

33、胶粘剂面：adhesive faec

34、原始光洁面：plate finish

35、粗面：matt finish

36、纵向：length wise direction

37、模向：cross wise direction

38、剪切板：cut to size panel

39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)

40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates(epoxy/paper CCL)

41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates

42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates

43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates

44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates

45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates

46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates

47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates

48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates

49、超薄型层压板：ultra thin laminate

50、陶瓷基覆铜箔板：ceramics base copper-clad laminates

51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

三、基材的材料

1、A阶树脂：A-stage resin

2、B阶树脂：B-stage resin

3、C阶树脂：C-stage resin

4、环氧树脂：epoxy resin

5、酚醛树脂：phenolic resin

6、聚酯树脂：polyester resin

7、聚酰亚胺树脂：polyimide resin

8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin

9、丙烯酸树脂：acrylic resin

10、三聚氰胺甲醛树脂：melamine formaldehyde resin

11、多官能环氧树脂：polyfunctional epoxy resin

12、溴化环氧树脂：brominated epoxy resin

13、环氧酚醛：epoxy novolac

14、氟树脂：fluroresin

15、硅树脂：silicone resin

16、硅烷：silane

17、聚合物：polymer

18、无定形聚合物：amorphous polymer

19、结晶现象：crystalline polamer

20、双晶现象：dimorphism

21、共聚物：copolymer

22、合成树脂：synthetic

23、热固性树脂：thermosetting resin

24、热塑性树脂：thermoplastic resin

25、感旋光性树脂：photosensitive resin

26、环氧当量：weight per epoxy equivalent(WPE)

27、环氧值：epoxy value

28、双氰胺：dicyandiamide

29、粘结剂：binder

30、胶粘剂：adesive

31、固化剂：curing agent

32、阻燃剂：flame retardant

33、遮光剂：opaquer

34、增塑剂：plasticizers

35、不饱和聚酯：unsatuiated polyester

36、聚酯薄膜：polyester

37、聚酰亚胺薄膜：polyimide film(PI)

38、聚四氟乙烯：polytetrafluoetylene(PTFE)

39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(FEP)

40、增强材料：reinforcing material

41、玻璃纤维：glass fiber

42、E玻璃纤维：E-glass fibre

43、D玻璃纤维：D-glass fibre

44、S玻璃纤维：S-glass fibre

45、玻璃布：glass fabric

46、非织布：non-woven fabric

47、玻璃纤维垫：glass mats

48、纱线：yarn

49、单丝：filament

50、绞股：strand

51、纬纱：weft yarn

52、经纱：warp yarn

53、但尼尔：denier

54、经向：warp-wise

55、纬向：weft-wise,filling-wise

56、织物经纬密度：thread count

57、织物组织：weave structure

58、平纹组织：plain structure

59、坏布：grey fabric

60、稀松织物：woven scrim

61、弓纬：bow of weave

62、断经：end missing

63、缺纬：mis-picks

64、纬斜：bias

65、折痕：crease

66、云织：waviness

67、鱼眼：fish eye

68、毛圈长：feather length

69、厚薄段：mark

70、裂缝：split

71、捻度：twist of yarn

72、浸润剂含量：size content

73、浸润剂残留量：size residue

74、处理剂含量：finish level

75、浸润剂：size

76、偶联剂：couplint agent

77、处理织物：finished fabric

78、聚酰胺纤维：polyarmide fiber

79、聚酯纤维非织布：non-woven polyester fabric

80、浸渍绝缘纵纸：impregnating insulation paper

81、聚芳酰胺纤维纸：aromatic polyamide paper

82、断裂长：breaking length

83、吸水高度：height of capillary rise

84、湿强度保留率：wet strength retention

85、白度：whitenness

86、陶瓷：ceramics

87、导电箔：conductive foil

88、铜箔：copper foil

89、电解铜箔：electrodeposited copper foil(ED copper foil)

90、压延铜箔：rolled copper foil

91、退火铜箔：annealed copper foil

92、压延退火铜箔：rolled annealed copper foil(RA copper foil)

93、薄铜箔：thin copper foil

94、涂胶铜箔：adhesive coated foil

95、涂胶脂铜箔：resin coated copper foil(RCC)

96、复合金属箔：composite metallic material

97、载体箔：carrier foil

98、殷瓦：invar

99、箔（剖面）轮廓：foil profile

100、光面：shiny side

101、粗糙面：matte side

102、处理面：treated side

103、防锈处理：stain proofing

104、双面处理铜箔：double treated foil

四、设计

1、原理图：shematic diagram

2、逻辑图：logic diagram

3、印制线路布设：printed wire layout

4、布设总图：master drawing

5、可制造性设计：design-for-manufacturability

6、计算机辅助设计：computer-aided design.(CAD)

7、计算机辅助制造：computer-aided manufacturing.(CAM)

8、计算机集成制造：computer integrat manufacturing.(CIM)

9、计算机辅助工程：computer-aided engineering.(CAE)

10、计算机辅助测试：computer-aided test.(CAT)

11、电子设计自动化：electric design automation.(EDA)

12、工程设计自动化：engineering design automaton.(EDA2)

13、组装设计自动化：assembly aided architectural design.(AAAD)

14、计算机辅助制图：computer aided drawing

15、计算机控制显示：computer controlled display.(CCD)

16、布局：placement

17、布线：routing

18、布图设计：layout

19、重布：rerouting

20、模拟：simulation

21、逻辑模拟：logic simulation

22、电路模拟：circit simulation

23、时序模拟：timing simulation

24、模块化：modularization

25、布线完成率：layout effeciency

26、机器描述格式：machine descriptionm format.(MDF)

27、机器描述格式数据库：MDF databse

28、设计数据库：design database

29、设计原点：design origin

30、优化（设计）：optimization(design)

31、供设计优化坐标轴：predominant axis

32、表格原点：table origin

33、镜像：mirroring

34、驱动文件：drive file

35、中间文件：intermediate file

36、制造文件：manufacturing documentation

37、队列支撑数据库：queue support database

38、组件安置：component positioning

39、图形显示：graphics dispaly

40、比例因子：scaling factor

41、扫描填充：scan filling

42、矩形填充：rectangle filling

43、填充域：region filling

44、实体设计：physical design

45、逻辑设计：logic design

46、逻辑电路：logic circuit

47、层次设计：hierarchical design

48、自顶向下设计：top-down design

49、自底向上设计：bottom-up design

50、线网：net

51、数字化：digitzing

52、设计规则检查：design rule checking

53、走（布）线器：router(CAD)

54、网络表：net list

55、计算机辅助电路分析：computer-aided circuit analysis

56、子线网：subnet

57、目标函数：objective function

58、设计后处理：post design processing(PDP)

59、交互式制图设计：interactive drawing design

60、费用矩阵：cost metrix

61、工程图：engineering drawing

62、方块框图：block diagram

63、迷宫：moze

64、组件密度：component density

65、巡回售货员问题：traveling salesman problem

66、自由度：degrees freedom

67、入度：out going degree

68、出度：incoming degree

69、曼哈顿距离：manhatton distance

70、欧几里德距离：euclidean distance

71、网络：network

72、阵列：array

73、段：segment

74、逻辑：logic

75、逻辑设计自动化：logic design automation

76、分线：separated time

77、分层：separated layer

78、定顺序：definite sequenc

五、形状与尺寸：

1、导线（信道）：conduction(track)

2、导线（体）宽度：conductor width

3、导线距离：conductor spacing

4、导线层：conductor layer

5、导线宽度/间距：conductor line/space

6、第一导线层：conductor layer No.1

7、圆形盘：round pad

8、方形盘：square pad

9、菱形盘：diamond pad

10、长方形焊盘：oblong pad

11、子弹形盘：bullet pad

12、泪滴盘：teardrop pad

13、雪人盘：snowman pad

14、V形盘：V-shaped pad

15、环形盘：annular pad

16、非圆形盘：non-circular pad

17、隔离盘：isolation pad

18、非功能连接盘：monfunctional pad

19、偏置连接盘：offset land

20、腹（背）裸盘：back-bard land

21、盘址：anchoring spaur

22、连接盘图形：land pattern

23、连接盘网格阵列：land grid array

24、孔环：annular ring

25、组件孔：component hole

26、安装孔：mounting hole

27、支撑孔：supported hole

28、非支撑孔：unsupported hole

29、导通孔：via

30、镀通孔：plated through hole(PTH)

31、余隙孔：access hole

32、盲孔：blind via(hole)

33、埋孔：buried via hole

34、埋/盲孔：buried/blind via

35、任意层内部导通孔：any layer inner via hole(ALIVH)

36、全部钻孔：all drilled hole

37、定位孔：toaling hole

38、无连接盘孔：landless hole

39、中间孔：interstitial hole

40、无连接盘导通孔：landless via hole

41、引导孔：pilot hole

42、端接全隙孔：terminal clearomee hole

43、准表面间镀覆孔：quasi-interfacing plated-through hole

44、准尺寸孔：dimensioned hole

45、在连接盘中导通孔：via-in-pad

46、孔位：hole location

47、孔密度：hole density

48、孔图：hole pattern

49、钻孔图：drill drawing

50、装配图：assembly drawing

51、印制板组装图：printed board assembly drawing

52、参考基准：datum referan

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